Think if we can integrate a GPS System on every Parcel we are sending via Courier or Post. It will be very easy for us to track the current location of the Parcel and the Handling of the Parcel. But, the system should be small like a Chip, and it should be of least cost. Don't forget that the GPS System has a Processor and an Antenna to receive the signals from the Satellite. How can we integrate the entire system inside a Small Chip? Here comes the application of MEMS.
MEMS is an emerging technology in which Microscopic Machines are developed by the tools and techniques that were developed for the Integrated Circuit (IC)ndustry.
MEMS is an emerging technology in which Microscopic Machines are developed by the tools and techniques that were developed for the Integrated Circuit (IC)ndustry.
MEMS structure |
Micro-Electro Mechanical systems (MEMS) is a technology that combines
computers with tiny mechanical devices such as sensors, valves, gears,
mirrors, and actuators embedded in semiconductor chips.
These machines are built on standard silicon wafers.
MEMS are made up of components between 1 to 100 micrometres in size
(i.e. 0.001 to 0.1 mm), and MEMS devices generally range in size from 20
micrometres (20 millionths of a metre) to a millimetre (i.e. 0.02 to
1.0 mm).
They usually consist of a Central Unit that processes data (the
microprocessor) and several components that interact with the outside
such as Microsensors.
Components of MEMS |
What are the Advantages of MEMS?
By utilizing this
technology, it is possible to integrate both Microelectronic circuits
and Mechanical structures on the same chip, enabling monolithic
integration while reducing the microsystem size and cost considerably.
What are the Applications of MEMS?
SMART BIOMEM (LAB ON A CHIP) |
This technology has an enormous number of application areas, including
- Automotive Eg. Accelerometers for airbag systems, Roll-over detection systems, etc.
- Biomedical Eg.Neural prosthesis devices like hearing and visual aids, Smart drug delivery systems, On Chip body fluid analysis systems, Microsurgery tools, Pacemakers
- Telecommunication Eg. Micromirrors for fiber optic switching for fast internet,Smart Antennas
- Household appliances pressure sensors for water level detection, frost sensors for refrigerators
- Consumer Applications DLP projectors, i-phone,
- Defense applications Eg. Low cost night vision, Smart munitions
Image Courtesy
www.engineersgarage.com
www.medgadget.com
I never ever read such type of info before this was really incredible.
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Package-level integration consists of bare die components assembled within a single package . A common example is a MEMS die and an application-specific integrated circuit (ASIC ) die assembled within a single package. All of the electronics have been integrated into the ASIC die, and the package integrated product contains only two components within the package . The typical size of a package-level integrated product can range from a few millimeters to a few centimeters on a side. who is a thought leader
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